Integrated circuit and memory device

ABSTRACT

A memory device includes a boot-up control unit configured to control a start of boot-up operation by starting the boot-up operation when an initialization signal is activated, and ignore the initialization signal after a complete signal is activated, a nonvolatile memory unit configured to store repair data, and output the stored repair data during the boot-up operation, a plurality of registers configured to store the repair data outputted from the nonvolatile memory unit, a plurality of memory banks configured to replace a normal cell with a redundant cell, using the repair data stored in the corresponding registers among the plurality of resistors, and a verification unit configured to generate the complete signal to notify that the boot-up operation is completed.

BACKGROUND

1. Field

Exemplary embodiments of the present invention relate to an integratedcircuit and a memory device, and more particularly, to a technology fortransmitting data stored in a nonvolatile memory in an integratedcircuit or memory device to numerous parts of the integrated circuit ormemory device.

2. Description of the Related Art

FIG. 1 is a diagram for illustrating a repair operation of aconventional memory device.

Referring to FIG. 1, the conventional memory device includes a cellarray 110, a row circuit 120, and a column circuit 130. The cell array110 includes a plurality of memory cells. The row circuit 120 isconfigured to enable a word line selected by a row address R_ADD. Thecolumn circuit 130 is configured to access (read or write) data of a bitline selected by a column address C_ADD.

A row fuse circuit 140 is configured to store a row address,corresponding to a memory cell having a defect in the cell array 110,and generate a repair row address REPAIR_R_ADD. A row comparison unit150 is configured to compare the repair row address REPAIR_R_ADD storedin the row fuse circuit 140 to the row address R_ADD inputted from anexternal source. When the repair row address REPAIR_R_ADD coincides withthe row address R_ADD, the row comparison unit 150 controls the rowcircuit 120 to enable a redundant word line instead of the word linedesignated by the row address R_ADD.

A column fuse circuit 160 is configured to store a column address,corresponding to a memory cell having a defect in the cell array 110,and generate a repair column address REPAIR_C_ADD. A column comparisonunit 170 is configured to compare the repair column address REPAIR_C_ADDfrom the column fuse circuit 160 to the column address C_ADD inputtedfrom an external source. When the repair column address REPAIR_C_ADDcoincides with the column address C_ADD, the column comparison unit 170controls the column circuit 130 to access a redundant bit line, insteadof the bit line designated by the column address C_ADD.

The row fuse circuit 140 and the column fuse circuit 160 (hereinafterreferred to as the fuse circuits) of FIG. 1 use laser fuses. The laserfuse stores high or low data depending on whether the fuse is cut ornot. The laser fuse may be programmed in a wafer state, but may not beprogrammed after the wafer is mounted in a package. Furthermore, thelaser fuse may not be designed small, because of a pitch limit. Toovercome such a design difficulty, an E-fuse may be used. The E-fuse mayinclude a transistor or capacitor and/or resistor. When the E-fuseincludes a transistor, the E-fuse stores data by changing resistancebetween a gate and a drain/source.

FIG. 2 is a diagram illustrating that the E-fuse including a transistoroperates as a resistor or capacitor.

Referring to FIG. 2, the E-fuse includes a transistor T. When a normalpower supply voltage, which the transistor T may tolerate, is suppliedto a gate G, the E-fuse operates as a capacitor C. Therefore, there isno current flowing between the gate G and a drain D or source S(hereinafter referred to as a drain-source D-S). However, when a highvoltage, which the transistor T may not tolerate, is supplied to thegate G, gate oxide of the transistor T may become inoperable to shortthe gate G and the drain-source D-S. In this case, the E-fuse operatesas a resistor R. Therefore, a current flows between the gate G and thedrain-source D-S.

Such a characteristic may be used to recognize the data of the E-fusethrough the resistance value between the gate G and the drain-source D-Sof the E-fuse. To recognize the data of the E-fuse, (1) the size of thetransistor T may be increased to directly recognize the data without aseparate sensing operation, or (2) an amplifier may be used to sense acurrent flowing in the transistor T without increasing the size of thetransistor T. In the above-described two methods, however, thetransistor T forming the E-fuse must be enlarged, or the amplifier foramplifying data must be provided for each E-fuse. Therefore, bothmethods have limitations and concerns over the size and space.

Because of the above-described concerns related to the size and space,it may not be easy to apply the E-fuse to the fuse circuits 140 and 160of FIG. 1. Therefore, as disclosed in U.S. Pat. Nos. 6,904,751,6,777,757, 6,667,902, 7,173,851, and 7,269,047, researches have beenconducted on a method for performing a repair operation using datastored in an E-fuse array including a plurality of E-fuses (in thiscase, the entire area may be reduced because an amplifier is shared).

To use data (for example, repair information) stored in a nonvolatilememory, such as an E-fuse array, provided in a memory device, a boot-upoperation must be performed to transmit the data stored in the E-fusearray to each area of the memory device where the data stored in theE-fuse array is used.

SUMMARY

Exemplary embodiments of the present invention are directed to anefficient scheme for transmitting data stored in an E-fuse array tonumerous parts of an integrated circuit or memory device.

Other exemplary embodiments of the present invention are directed to ascheme for deciding a performance period of a boot-up operation.

In accordance with an embodiment of the present invention, a memorydevice includes a boot-up control unit configured to control a start ofboot-up operation by starting the boot-up operation when aninitialization signal is activated, and ignore the initialization signalafter a complete signal is activated, a nonvolatile memory unitconfigured to store repair data, and output the stored repair dataduring the boot-up operation, a plurality of registers configured tostore the repair data outputted from the nonvolatile memory unit, aplurality of memory banks configured to replace a normal cell with aredundant cell, using the repair data stored in the correspondingregisters among the plurality of resistors, and a verification unitconfigured to generate the complete signal to notify that the boot-upoperation is completed.

In accordance with another embodiment of the present invention, a memorydevice includes a boot-up control unit configured to control a start ofboot-up operation by starting the boot-up operation when aninitialization signal is activated, and ignore the initialization signalafter a setting command is activated, a nonvolatile memory unitconfigured to store repair data, and output the stored repair dataduring the boot-up operation, a plurality of registers configured tostore the repair data outputted from the nonvolatile memory unit, and aplurality of memory banks configured to replace a normal cell with aredundant cell, using the repair data stored in the correspondingregisters among the plurality of registers.

In accordance with yet another embodiment of the present invention, anintegrated circuit includes a boot-up control unit configured to controla start of boot-up operation by starting the boot-up operation when aninitialization signal is activated, and ignore the initialization signalafter a complete signal is activated, a nonvolatile memory unitconfigured to output data stored therein during the boot-up operation, aplurality of registers configured to store the data outputted from thenonvolatile memory unit, an internal circuit configured to use the datastored in the plurality of registers, and a verification unit configuredto generate the complete signal to notify that the boot-up operation iscompleted.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram for illustrating a repair operation of aconventional memory device.

FIG. 2 is a diagram illustrating that an E-fuse including a transistoroperates as a resistor or capacitor.

FIG. 3 illustrates a nonvolatile memory unit that stores repairinformation in a memory device.

FIG. 4 is a configuration diagram of a memory device in accordance withan embodiment of the present invention.

FIG. 5 is a configuration diagram of a memory device in accordance withanother embodiment of the present invention.

FIG. 6 is a configuration diagram of a memory device in accordance withanother embodiment of the present invention.

FIG. 7 is a configuration diagram of a boot-up control unit of FIGS. 4and 6.

FIG. 8 is a timing diagram illustrating the operation of the boot-upcontrol unit of FIG. 7.

DETAILED DESCRIPTION

Exemplary embodiments of the present invention will be described belowin more detail with reference to the accompanying drawings. The presentinvention may, however, be embodied in different forms and should not beconstrued as limited to the embodiments set forth herein. Rather, theseembodiments are provided so that this disclosure will be thorough andcomplete, and will fully convey the scope of the present invention tothose skilled in the art. Throughout the disclosure, like referencenumerals refer to like parts throughout the various figures andembodiments of the present invention.

FIG. 3 illustrates a nonvolatile memory unit that stores repairinformation in a memory device.

Referring to FIG. 3, the memory device includes a plurality of memorybanks BK0 to BK7, a plurality of registers 310_0 to 310_7 provided inthe respective memory banks and configured to store a repair address,and a nonvolatile memory unit 320.

The nonvolatile memory unit 320 substitutes for the conventional fusecircuits 140 and 160 (shown in FIG. 1). Here, the nonvolatile memoryunit 320 stores repair information, which includes a repair address,corresponding to all of the banks BK0 to BK7. The nonvolatile memoryunit 320 may include an E-fuse array or various nonvolatile memoriessuch as flash memory and Electrically Erasable Programmable Read-OnlyMemory (EEPROM).

The registers 310_0 to 310_7 provided for the respective banks BK0 toBK7 are configured to store the repair information of the correspondingmemory banks BK0 to BK7, respectively. For example, the registers 310_0store the repair information of the memory bank BK_0, and the registers310_4 store the repair information of the memory bank BK_4. Theregisters 310_0 to 310_7 receive and store the repair information fromthe nonvolatile memory unit 320 of the memory device.

Since the nonvolatile memory unit 320 is configured in an array type,the nonvolatile memory unit 320 requires a predetermined time to calldata stored therein. Therefore, it may be difficult to perform a repairoperation by directly using the data stored in the nonvolatile memoryunit 320. Therefore, a boot-up operation is necessarily required totransmit the information stored in the nonvolatile memory unit 320 tothe respective registers 310_0 to 310_7. After the boot-up operation,the data stored in the registers 310_0 to 310_7 may be used in therepair operation.

In order for the nonvolatile memory unit 320 to transmit data to theregisters 310_0 to 310_7, an address for designating registers among theregisters 310_0 to 310_7 must be transmitted together with the data tobe stored in the registers 310_0 to 310_7. Hereafter, a scheme forsimplifying the data transmission and when to start the boot-upoperation will be described.

FIG. 4 is a configuration diagram of the memory device in accordancewith the embodiment of the present invention.

Referring to FIG. 4, the memory device includes a boot-up control unit400, a nonvolatile memory unit 410, a plurality of registers 420_0_0 to420_7_N, a plurality of memory banks BK0 to BK7, and a verification unit430.

The boot-up control unit 400 is configured to control a start of boot-upoperation whenever an initialization signal RSTB is activated, andignore the initialization signal RSTB after a complete signal COMPLETEis activated. Specifically, the boot-up control unit 400 activates aboot-up enable signal BOOTEN to start the boot-up operation of thenonvolatile memory unit 410 whenever the initialization signal RSTB isactivated. However, once the boot-up operation is completed, the boot-upcontrol unit 400 ignores the reset signal RSTB even though theinitialization signal RSTB is activated, and does not activate theboot-up enable signal BOOTEN. FIG. 4 illustrates that a reset signalRSTB inputted from an external source through a pad 401 is used as theinitialization signal. However, any signal activated during theinitialization operation period of the memory may be used as theinitialization signal, instead of the reset signal RSTB.

A pulse signal generation unit 440 is configured to generate a pulsesignal BOOTEN_P, which is activated shortly after the activation timepoint of the boot-up enable signal BOOTEN. Here, the generated pulsesignal BOOTEN_P may be used to reset the registers 420_0_0 to 420_7_N.

The nonvolatile memory unit 410 stores repair data of the memory banksBK0 to BK7, that is, an address of memory cells having a defect. Thenonvolatile memory unit 410 transmits data through a data line DATALINE. The nonvolatile memory unit 410 outputs a clock signal CLKgenerated from an internal oscillator (or generated using a clock signalinputted from an external source), and the clock signal CLK issynchronized with the data of the data line DATA LINE. The nonvolatilememory unit 410 may include an E-fuse array or various nonvolatilememories such as flash memory and EEPROM. The operation of thenonvolatile memory unit 410 is performed while the boot-up enable signalBOOTEN is activated. That is, when the boot-up enable signal BOOTEN isactivated, the nonvolatile memory unit 410 transmits stored data to thedata line DATA LINE based on a predetermined order in synchronizationwith the clock signal CLK.

The plurality of registers 420_0_0 to 420_7_N store repair informationof the corresponding banks. For example, the registers 420_0_0 to420_0_N store the repair information of the first memory bank BK0, andthe registers 420_5_0 to 420_5_N store the repair information of thesixth memory bank BK5. The plurality of registers 420_0_0 to 420_7_N areconnected in series to form one shift register. The plurality ofregisters 420_0_0 to 420_7_N shift and store the data transmitted to thedata line DATA LINE in synchronization with the clock signal CLK. Forexample, when the clock signal CLK is toggled for the first time, firstdata transmitted to the data line DATA LINE for the first time is storedin the register 420_0_0. When the clock signal CLK is toggled for thesecond time, the first data transmitted to the data line DATA LINE (thatis, the data stored in the register 420_0_0) is stored in the register420_0_1, and second data transmitted to the data line DATA LINE for thesecond time is stored in the register 420_0_0. Each of the registers420_0_0 to 420_7_N may include a D flip-flop.

The memory banks BK0 to BK7 perform a repair operation of replacing anormal cell with a redundant cell, using the repair data stored in thecorresponding registers 420_0_0 to 420_7_N. Each of the memory banks BK0to BK7 may include a DRAM cell array or FLASH cell array.

The verification unit 430 is configured to verify whether or not thedata outputted from the nonvolatile memory unit 410 are stored in all ofthe registers 420_0_0 to 420_7_N. The verification unit 430 activatesthe complete signal COMPLETE when a predetermined time passes from thestart of operation of the nonvolatile memory unit 410. In other words,the verification unit 430 activates the complete signal COMPLETE when atime required for the nonvolatile memory unit 410 to transmit data tothe registers 420_0_0 to 420_7_N passes. The verification unit 430 maybe designed to count the number of activations of the clock signal CLKduring the activation period of the boot-up enable signal BOOTEN andactivate the complete signal COMPLETE when the count reaches a presetvalue. The count of the verification unit 430 may be reset by the pulsesignal BOOTEN_P generated by the pulse signal generation unit 440.Furthermore, the verification unit 430 may transmit the complete signalCOMPLETE to the nonvolatile memory unit 410 such that the clock signalCLK outputted from the nonvolatile memory unit 410 is not toggled thecomplete signal COMPLETE is activated.

Referring to FIG. 4, during the boot-up operation for transmitting thedata of the nonvolatile memory unit 410 to the registers 420_0_0 to420_7_N, the clock signal CLK is transmitted instead of an address, andthe registers 420_0_0 to 420_7_N are connected in a shift register typeto shift and store the data outputted from the nonvolatile memory unit410 in synchronization with the clock signal CLK. Therefore, a multi-bitaddress does not need to be transmitted to the registers 420_0_0 to420_7_N from the nonvolatile memory unit 410, which may significantlyreduce the size and space of the memory device.

Furthermore, the boot-up operation is performed again whenever theinitialization signal RSTB is activated. However, after the boot-upoperation is completed, the initialization signal RSTB is ignored eventhough the initialization signal RSTB is activated by mistake.Therefore, it may prevent the boot-up operation from being repetitivelyperformed or imperfectly performed when the initialization signal RSTBis activated by mistake.

FIG. 5 is a configuration diagram of a memory device in accordance withanother embodiment of the present invention.

The memory device of FIG. 5 is different from the memory device of FIG.4 in that a boot-up control unit 500 receives a setting command MRSgenerated from a command decoder 510, instead of the complete signalCOMPLETE.

The command decoder 510 is configured to decode command signals appliedfrom an external source through command pads 501 and generate a command.The command generated by the command decoder 510 may include an activecommand, a precharge command, a read command, a write command, a refreshcommand, a setting command MRS, and the like. Since the setting commandMRS is directly related to the embodiment of present invention, FIG. 5illustrates only the setting command MRS among various commands.

The boot-up control unit 500 may be designed in the same manner as theboot-up control unit 400 of FIG. 4, except that the boot-up control unit500 receives the setting command MRS instead of the complete signalCOMPLETE. The memory device activates the setting command MRS forperforming various setting operations of the memory device after aninitialization process, which includes a power-up operation and a resetoperation of internal circuits, is completed. After the setting commandMRS is activated, a normal operation of the memory device is performed.Therefore, the boot-up operation must be completed before the settingcommand MRS is applied. Therefore, the boot-up control unit 500 controlsthe boot-up operation by not performing the operation even though thereset signal RSTB is activated by mistake, under the supposition thatthe boot-up operation is already normally completed after the settingcommand MRS is applied.

Since components having the same reference numerals as those of FIG. 5have been already described above, the detailed descriptions identicalor similar components are omitted.

FIG. 6 is a configuration diagram of a memory device in accordance withanother embodiment of the present invention.

The memory device of FIG. 6 generates the complete signal COMPLETE in amanner different from the memory device of FIG. 4.

In FIG. 6, when the boot-up enable signal BOOTEN is activated, thenonvolatile memory unit 410 does not output data, which are to be storedin the plurality of registers 420_0_0 to 420_7_N, but transmits apredetermined data pattern prior to the data to be stored. For example,a four-bit data pattern of ‘1010’ may be outputted from the nonvolatilememory unit 410. A verification unit 630 receives data outputted fromthe last register 420_7_N forming a shift register. The verificationunit 630 checks whether or not the predetermined data pattern istransmitted from the last register, and verifies that all of the datawere transmitted to the registers 420_0_0 to 420_7_N from thenonvolatile memory unit 410.

The verification unit 630 and the pulse signal generation unit 610 ofFIG. 6 may be applied to the memory device of FIG. 5.

FIG. 7 is a configuration diagram of the boot-up control unit 400 ofFIGS. 4 and 6.

Referring to FIG. 7, the boot-up control unit 400 includes a rising edgedetection section 710, a falling edge detection section 720, an inverter730, a NOR gate 740, and SR latches 750 and 760.

The rising edge detection section 710 is configured to activate a risingdetection signal RD to a high level at a rising edge where theinitialization signal RSTB transits from a low level to a high level.Since the initialization signal RSTB is activated to a low level, therising edge detection section 710 activates the rising detection signalRD at the moment when the initialization signal RSTB is deactivated.

The falling edge detection section 720 activates a falling detectionsignal FD to a high level at a falling edge where the initializationsignal RSTB transits from a high level to a low level. The falling edgedetection section 720 activates the falling detection signal FD at themoment when the initialization signal RSTB is activated.

The SR latch 750 uses a complete signal COMPLETE as a set signal anduses a power-up signal PWRUP as a reset signal. The SR latch 750activates a control signal CONTROL to a high level in response to theactivation of complete signal COMPLETE. Alternatively, the SR latch 750deactivates the control signal CONTROL to a low level in response to theactivation of power-up signal PWRUP. Here, the power-up signal PWRUP isactivated when internal voltages are stabilized after power-up of thememory device. The control signal CONTROL maintains a deactivated stateafter power-up of the memory device, and maintains an activated stateafter the complete signal COMPLETE is activated.

The NOR gate 740 is configured to output the rising detection signal RDwhile the control signal CONTROL is deactivated, that is, before theboot-up operation is completed. Furthermore, while the control signalCONTROL is activated, that is, after the boot-up operation is completed,the NOR gate 740 always outputs a signal, which is deactivated to a lowlevel, regardless of the level of the rising detection signal RD.

The SR latch 760 activates the boot-up enable signal BOOTEN to a highlevel, when the output signal of the NOR gate 740 is activated to a highlevel. Furthermore, when the falling detection signal FD is activated toa high level, the boot-up enable signal BOOTEN is deactivated to a lowlevel.

The boot-up control unit 500 of FIG. 5 may be designed in the samemanner as the boot-up control unit 400 of FIG. 7, except that theboot-up control unit 500 receives the setting command MRS instead of thecomplete signal COMPLETE.

FIG. 8 is a timing diagram illustrating the operation of the boot-upcontrol unit 400 of FIG. 7.

Referring to FIG. 8, the power-up signal PWRUP is activated at the sametime when the memory device is started. Then, the control signal CONTROLis deactivated to a low level in response to the power-up signal PWRUP.

Then, when the initialization signal RSTB is activated to a low leveland then deactivated to a high level (801), the boot-up enable signalBOOTEN is activated to a high level. When the initialization signal RSTBis activated again to a low level before the boot-up operation iscompleted (802), the boot-up enable signal BOOTEN is deactivated to alow level. When the initialization signal RSTB is deactivated to a highlevel (803), the boot-up enable signal BOOTEN is activated to a highlevel. When the activation period of the boot-up enable signal BOOTEN issufficiently secured to complete the boot-up operation, the completesignal COMPLETE is activated (804). After the complete signal COMPLETEis activated, the boot-up enable signal BOOTEN is deactivated to a lowlevel, and continuously maintains the state deactivated to a low level,regardless of the activation (805) of the initialization signal RSTB.

In general, the initialization signal such as a reset signal RSTB isactivated for only one time during an initialization operation. However,the reset signal RSTB may be activated several times by noises between amemory controller and the memory device. In accordance with theembodiment of the present invention, the boot-up operation is startedwhenever the reset signal RSTB is activated, but once the boot-upoperation is completed, the reset signal RSTB activated afterwards isignored. Therefore, although the reset signal RSTB is activated severaltimes by mistake, it may prevent an error in which the boot-up operationis repetitively performed.

In the above-described embodiments of the present invention, the presentinvention is applied to the memory device. However, the presentinvention may be applied to all types of integrated circuits, whichinclude a nonvolatile memory unit and require a boot-up operation totransmit data stored in the nonvolatile memory unit to registers.Furthermore, it has been described that the data stored in the registersare used for a repair operation through the boot-up operation. However,the data stored in the registers may be used in other various types ofinternal circuits.

Furthermore, it has been described that, after the boot-up operation iscompleted or an effective setting command is applied, the boot-upoperation is not performed even though the initialization signal isactivated. However, the memory device may be designed to perform theboot-up operation again when the initialization signal is activated evenafter the boot-up operation is completed or an effective setting commandis applied in a specific state such as a test mode.

While the present invention has been described with respect to thespecific embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the invention as defined in the followingclaims.

1-7. (canceled)
 8. A memory device comprising: a boot-up control unitconfigured to control a start of boot-up operation by starting theboot-up operation when an initialization signal is activated, and ignorethe initialization signal after a setting command is activated; anonvolatile memory unit configured to store repair data, and output thestored repair data during the boot-up operation; a plurality ofregisters configured to store the repair data outputted from thenonvolatile memory unit; and a plurality of memory banks configured toreplace a normal cell with a redundant cell, using the repair datastored in the corresponding registers among the plurality of registers.9. The memory device of claim 8, wherein the initialization signalcomprises a reset signal.
 10. The memory device of claim 8, wherein theboot-up control unit activates a boot-up enable signal when theinitialization signal transits from an activated state to a deactivatedstate, deactivates the boot-up enable signal when the initializationsignal transits from a deactivated state to an activated state, andmaintains the boot-up enable signal in a deactivated state regardless ofthe initialization signal, after the setting command is activated. 11.The memory device of claim 10, wherein the nonvolatile memory unitoutputs the stored repair data during the activation period of theboot-up enable signal.
 12. The memory device of claim 8, wherein theplurality of registers are connected in a shift register type, and shiftand store the repair data outputted from the nonvolatile memory unit insynchronization with a clock signal. 13-18. (canceled)